We use first class packaging facilities all over the world to assure high quality, redundant assembly capability. From state of the art chip scale package profiles to die in the waffle pack, we provide our customers with solutions that meet their budget and size objectives.

Options

Dual SOIC SOIJ SOP SSOP TSOP TSSOP DIP

I/O 8 to 44 8 to 44 8 to 64 8 to 64 8 to 80 8 to 80

Quad LQFP TQFP MQFP PLCC

I/O 32 to 208 32 to 208 44 to 304 20 to 84

Miniature QFN CS BGA

I/O 4 to 68 8 to 200 40 to 200

Special Order
Ceramic packages, open cavity, flip-chip and multi-chip modules available on request. Contact System To ASIC for more information.