Quality and Precision

At System To ASIC, design and test are closely linked for optimal analog performance and maximum Mixed Signal testing efficiency. Achieving high throughput, while maintaining the high measurement accuracy demanded by Analog and Mixed-Signal ASICs, requires substantial customization of commercially available Automated Test Equipment (ATE). As one of many improvements, we have reduced the test lead length from (ATE) test head to Device Under Test (DUT) by an order of magnitude, thus reducing noise and stray pin loading during test. The result is a dramatic increase in speed, repeatability, package yield, and overall test quality.

Mixed Signal Focus

• Fully automated wafer and package level test
• Fully automated, online test and QA procedures
• Mil-Std-105
• 100% wafer level test, each device
• 100% package level test, each package
• Real-time yield statistics
• Wafer and package level tests correlated
• 100% Datalog, each device
• At temperature test