ASIC Packaging | WLCSP
We use first-class ASIC packaging facilities all over the world to assure high quality, redundant assembly capability. From state of the art chip scale package profiles to die in the waffle pack, we provide our customers with solutions that meet their budget and size objectives.
ASIC Packaging Options
ASIC Packaging – Popular Drawings
Below are links to our most popular packages:
Ceramic packages, open cavity, flip-chip and multi-chip modules available on request. Contact System To ASIC for more information.