ASIC Packaging | WLCSP

We use first-class ASIC packaging facilities all over the world to assure high quality, redundant assembly capability. From state of the art chip scale package profiles to die in the waffle pack, we provide our customers with solutions that meet their budget and size objectives.

Click to view our most popular packages.

ASIC Packaging Options

Miniature

  • QFN
  • CS
  • BGA

I/O

  • 8 to 44
  • 8 to 44
  • 8 to 64
  • 8 to 64
  • 8 to 80
  • 8 to 8o

QUAD

  • LQFP
  • TQFP
  • MQFP
  • PLCC

I/O

  • 32 to 208
  • 32 to 208
  • 44 to 304
  • 20 to 84

DUAL

  • SOIC
  • SOIJ
  • SOP
  • SSOP
  • TSOP
  • TSSOP
  • DIP

I/O

  • 4 to 68
  • 8 to 200
  • 40 to 200

ASIC Packaging – Popular Drawings

Package Specifications

Below are links to our most popular packages:

3x3 10L ASIC Package

4x4 16L ASIC package

4x4 20L ASIC Package

4x4 24L ASIC Package

5x5 28L ASIC Package

5x5 32L ASIC Package



Special Order

Ceramic packages, open cavity, flip-chip and multi-chip modules available on request. Contact System To ASIC for more information.

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