ASIC Manufacturing – Test

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Quality and Precision

At System To ASIC, functional design and design for test are closely linked and required for optimal analog performance and maximum testing efficiency of mixed signal devices. Design for test starts very early in the development process as an inherent element of our ASIC design services, ensuring that built-in provisions for full test coverage optimized for speed and high confidence measurements are always a fundamental part of the ASIC design.

In addition to designing the ASIC for test, the Automated Test Equipment (ATE) used for mixed signal production test must also be addressed. Achieving high throughput, while maintaining the high measurement accuracy demanded in production testing analog and mixed signal ASICs, requires substantial customization of commercially available ATE. As one of System To ASIC’s many test optimizations, we have reduced the test lead length from ATE test head to Device Under Test (DUT) by an order of magnitude, thus reducing noise and stray pin loading during test. The result is a dramatic increase in speed, repeatability, package yield, and overall test quality.

Mixed Signal Focus

  • Fully automated wafer and package level test
  • Fully automated, online test and QA procedures
  • Mil-Std-105
  • 100% wafer level test, each device
  • 100% package level test, each package
  • Real-time yield statistics
  • Wafer and package level tests correlated
  • 100% Datalog, each device
  • At temperature test